It does have an onboard thermometer and probably will be worthwhile to keep an eye on it.A number of posts on the forums have expressed interest in connecting the P2 to an ESP32, thereby giving the P2 access to the outside world. That is, it needs package thermal characteristics and power consumption for the CPU, peripherals and all of the radio power consumption. The data sheet doesn't include the information needed to design to that. It is unclear whether a mating thermal pad is needed. I have a footprint which matches the current modules we have but not sure it will match any others we buy. That does match the physical board but the gerbers we recently downloaded measures to be 5.5mm. The X dimension from the left edge of the PCB to the left edge of the thermal pad is 6.3mm in the datasheet. We printed footprint transparency to compare with the physical module. I used gerbv and altium designer to measure the gerbers. We measured both the board and gerbers to be at 8.53mm. The Y dimension of the thermal pad in the datasheet of 7.3mm from bottom edge of the board to the bottom of the thermal pad doesn't match either the gerbers or physical measurement of the ESP-WROOM-32 module. There is a discrepancy in the measurements given though. The earlier datasheets showed the thermal pad at 6mm x 6mm area and the most recent datasheet, this was changed to 4mm x 4mm. The datasheet pin out does show a thermal pad with dimensions and the physical module we bought definitely has one. The dev kit for this module doesn't have the mating thermal pad in the gerber files. This is common for QFN packages and it doesn't appear to require electrical connection. This thermal pad is attached to the exposed DAP (die attached paddle) of the ESP32 chip. It wasn't a problem to come up with signal and power pads that surrounded the circumference of the LGA module but the large thermal pad has been a pain. The ESP-WROOM-32 had a pinout with measurements but no dimension footprint like they did on the earlier modules.
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